QUICK 7720 BGA rework station is china brand BGA repairing platform, with microprocessor control, it is designed for BGA / CSP and other SMT surface mount components for repair and welding, and welding by using a dedicated software -BGASoft control the entire process, recording all of its information, to meet the modern electronics industry higher technical requirements, QUICK 7720 BGA rework system is one of the most valuable electronic tools electronics industry.

QUICK 7720 BGA rework station QUICK 7720 BGA repairing platform

QUICK 7720 BGA rework station infrared heating and hot air heating in harmony together. In order to obtain optimum control of the welding process can be repeated and non-destructive production of PCB temperature, QUICK 7720 BGA rework station provides maximum power adjustable heating power of 3500W, the top heater using hot air heating, infrared heating bottom preheating, a combination of hot air heating, hot air locally heating the bottom of PCB BGA corresponding part, and to control the temperature profile, the corresponding part of the infra-red heating the PCB board, to control the entire preheating temperature, to prevent local deformation of the PCB, the heat distribution. In order to ensure uniform heat distribution and appropriate peak temperature, in order to achieve high reliability of lead-free solder. Infrared heating part according BGA different locations on the PCB, and is free to move in the X-axis. Using a frame-shaped structure movable PCB holder and can be placed shaped plate support bars, consistent with the cross arm is connected to the bottom of the support bar, easy to place each PCB when applicable larger size PCB.
 
QUICK 7720 BGA rework station also comes with integrated process control software and show the program to facilitate the realization of multiple control. The most significant users can meet the requirements of BGA rework, especially in the lead-free rework to better reflect its uniqueness.

QUICK 7720 Applications:

QUICK 7720 BGA rework station is suitable for laptops, desktops, servers, industrial control panels, switches and other products for the welding process and rework BGA, CSP, QFP, PLCC packages and other devices, removal or repair, and can meet the requirements of lead-free soldering .

The main technical parameters:

 
Power Specifications 220V, 50Hz, 3KW
Smallest chip size 2 * 2mm
The maximum chip size 60 * 60mm
Preheat the bottom of radiation size 330 * 360mm
Hot air heating temperature 500 ℃ (max)
The bottom of the preheating temperature of 500 ℃ (max)
Top hot air heating power 700W
The bottom of the hot-air heating power 700W
Bottom preheating power 400W * 4 = 1600W (infrared heating)
Adjustable side wind speed cooling fan ≦ 3.5 m³ / min
K-type sensor 3
Communication standard RS-232C (available with PC)
Dimensions 650 (L) * 570 (W) * 500 (H) mm
Equipment weight about 43Kg

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Technical Support: Free

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